Layers

1~32

Board thickness

0.1mm-7.0mm

Material

FR-4，CEM-1/CEM-3，PI，High Tg，Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP，HASL，Imm Gold/Nickel/Ag， Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue 

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH：±0.05 NPTH：±0.025

Certificate

UL，ISO 9001，ISO14001，IATF16949

Special request

Blind hole+Gold finger  + BGA

Material Suppilers

 Shengyi, KB, Nanya, ITEQ,etc.